White Paper ADDENDUM: The mechanical properties of Finar Buffer.

Aggiornato il: lug 18



Finar Buffer as you can see in the drawing below is a self-standing closely packed pin grid array (CPPGA).

Buffer made from copper has the same CTE as copper and offers nearly solid thermal conductivity in the vertical direction (y direction), Elasticity in y direction can be locally adjusted from nearly 0GPa to >10GPa allowing to control pressure locally and eventually apply a specific pressure map on the surrounding layers, elasticity in the xz plane is extremely low allowing for the outstanding CTE MATCHING capabilities.

Typical thickness to be considered is 0.5-1mm. Eventually attach solder thickness can be considered 10um

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Finar Module S.a.g.l.

Via Balestra 15A

Lugano

Switzerland

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