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FM Tech will be a big future "Disruptor". It is a rock-solid, cheap, reliable solution, bringing huge cost savings.
FM Tech addresses the thermal dynamic of the entire packaging system. We came from a different perspective, so we never set out to make incremental improvements in the component parts. We have a whole new and simplified platform. Cost savings are driven from a significant reduction in chip size requirement and simplified architectures, with Finar Buffer replacing many of the conventional components.
As a result, FM Tech works across the spectrum of power devices:
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Un-insulated Discretes
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Insulated Discretes
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Power Modules
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Intelligent Power Modules
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High Power Stack Packs
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Press Packs
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Studs
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LEDs
It can also handle Wide Bandgap (WBG) semiconductor materials - the next generation semiconductors.
FM Tech Power Module - Simple Building Blocks
FM Tech Power Module with Attach
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70% Reduction in Thermal Resistance
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50% Increase in Power Density
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Long Lifespan: 180X Lesit
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30% Decrease in Bill of Materials (Costs)
In an extremely price sensitive industry the advantages of FM Tech and the opportunities it will create will really make the difference.
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In a nutshell, our technology enables you to get more power performance or smaller chips (therefore at lower cost) providing higher power densities all with greater robustness!!
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See How It Works
Our performance improvements are game changing tectonic shifts!
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