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FM Tech will be a big  future "Disruptor".  It is a rock-solid, cheap, reliable  solution,  bringing huge cost savings.
FM Tech addresses the thermal dynamic of the entire packaging system.  We came from a different perspective, so we never set out to make incremental improvements in the component parts.  We have a whole new and simplified platform.  Cost savings are driven from a significant reduction in chip size requirement and simplified architectures, with Finar Buffer replacing many of the conventional components.
 
As a result, FM Tech works across the spectrum of power devices:
  • Un-insulated Discretes
  • Insulated Discretes
  • Power Modules
  • Intelligent Power Modules
  • High Power Stack Packs
  • Press Packs
  • Studs
  • LEDs
It can also handle Wide Bandgap (WBG) semiconductor materials - the next generation semiconductors.
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FM Tech Power Module - Simple Building Blocks
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FM Tech Power Module  with Attach
  • 70% Reduction in Thermal Resistance
  • 50% Increase in Power Density
  • Long Lifespan: 180X Lesit
  • 30% Decrease in Bill of Materials (Costs)
 
In an extremely price sensitive industry the advantages of FM Tech and the opportunities it will create will really make the difference.
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In a nutshell, our technology enables you to get more power performance or smaller chips (therefore at lower cost) providing higher power densities all with greater robustness!!
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See How It Works
Our performance improvements are game changing tectonic shifts!
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