Extreme Thermo Mechanical Performance
Finar Module is proud to have been the 2nd Place Winner in Switzerland's Boldbrain Start-UP Challenge in December 2020
OUR MISSION: to revolutionize LED and power device packaging
FM Tech is a next generation idea, at its core is an engineered buffer structure, that provides CTE MATCHING properties between different materials in power device packaging and also has excellent thermal and electrical characteristics. This provides phenomenal reliability and also allows optimal stacking architecture and simplified design and production, while still using standard economic materials.
Higher power densities
Reduced production cost